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Tensor Revive 探索复芯 Precision GPU Revival Tensor Revive
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Our Capabilities 服务能力

Services 服务

全栈 GPU 硬件服务

Six core service lines covering the full spectrum of GPU hardware operations — from component-level board repair to regulatory compliance. Each service is backed by documented processes, traceable workflows, and industry-standard equipment.

六大核心服务线,覆盖 GPU 硬件运维全链条 — 从组件级板卡维修到法规合规。每项服务均依托文档化流程、可追溯工作流和行业标准设备。

SVC
01

Board-Level Repair 组件级维修

Component-Level Diagnostics & Rework

Our core competency. We diagnose and repair GPU boards, server motherboards, and interconnect hardware at the component level — down to individual BGA packages and passive components. Every repair follows IPC-7711/7721 rework standards with full traceability from intake to ship.

核心能力。我们在组件级别诊断和修复 GPU 板卡、服务器主板及互连硬件 — 精确到单颗 BGA 封装和被动元件。所有维修遵循 IPC-7711/7721 返工标准,从接收到出厂全流程可追溯。

PCB Diagnostics
PCB 诊断
Multi-layer PCB fault isolation using boundary scan, flying probe, and thermal imaging. We identify opens, shorts, and degraded vias across 16+ layer boards common in GPU accelerators.
使用边界扫描、飞针测试和热成像进行多层 PCB 故障隔离。可识别 GPU 加速卡常见的 16+ 层板上的开路、短路和劣化过孔。
BGA Rework
BGA 返工
Reballing and replacement of BGA packages up to 55mm x 55mm. Controlled thermal profiles prevent substrate warpage. Post-rework X-ray inspection verifies solder joint integrity across all ball positions.
支持最大 55mm x 55mm 的 BGA 封装重植球和更换。受控热曲线防止基板翘曲。返工后 X 射线检查验证所有球位焊点完整性。
Micro-Soldering
微焊接
Precision soldering of 0201-size passives, QFN/DFN packages, and fine-pitch connectors. Performed under stereo microscope with ESD-safe tooling. Critical for high-density power delivery sections on GPU boards.
精密焊接 0201 尺寸被动元件、QFN/DFN 封装及细间距连接器。在体视显微镜下使用 ESD 安全工具操作,对 GPU 板卡高密度供电区域至关重要。
Signal Integrity Analysis
信号完整性分析
High-bandwidth oscilloscope measurements on HBM, PCIe Gen5, and NVLink SerDes lanes. Eye diagram analysis identifies marginal signals before they cause field failures.
使用高带宽示波器测量 HBM、PCIe Gen5 和 NVLink SerDes 通道。眼图分析可在现场故障发生前识别边际信号。
X-Ray Inspection
X 射线检测
2D and oblique-angle X-ray imaging for BGA void analysis, head-in-pillow detection, and bridge identification. Non-destructive verification of hidden solder joints that optical inspection cannot reach.
2D 及斜角 X 射线成像,用于 BGA 空洞分析、枕头效应检测和桥接识别。对光学检查无法触及的隐藏焊点进行无损验证。
Thermal Profiling
热曲线分析
Multi-zone thermal profiling for reflow and rework operations. Profiles are validated against solder paste and component manufacturer specifications to ensure joint reliability across the full operating temperature range.
多区热曲线分析用于回流和返工操作。曲线经锡膏和元件制造商规格验证,确保焊点在全工作温度范围内的可靠性。
NVIDIA A100 NVIDIA H100 NVIDIA H200 AMD MI250 AMD MI300X Server Motherboards GPU Backplanes NVLink Bridges HGX Baseboards
On-Site Repair
驻场维修
Flexible deployment: our lab or your site. Embedded repair teams at customer facilities, operating on customer-provided equipment and tooling. Seamless integration with existing workflows.
灵活部署:我们的实验室或您的现场。驻场维修团队在客户设施内工作,使用客户提供的设备和工具,无缝融入现有工作流。
High-Risk Rework
高风险返工
Specialized protocols for high-risk operations: CPU removal, high-density BGA, and advanced failure analysis. Structured risk assessment and scrap risk framework for complex repair operations.
高风险操作专用协议:CPU 拆卸、高密度 BGA 及高级失效分析。复杂维修操作的结构化风险评估和报废风险框架。
Consigned Equipment
委托设备模式
Flexible equipment models: customer-consigned or provider-furnished. Full accountability and chain-of-custody documentation for all consigned tools, fixtures, and materials.
灵活的设备模式:客户委托或服务商自备。对所有委托工具、治具和物料实行全责管理和保管链文档化。
Turnaround
5 – 10 business days
Warranty
Warranty-backed
Standards
IPC-7711/7721, J-STD-001
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System Testing & Validation 系统测试与验证

Electrical, Thermal & Functional Verification

Every repaired or refurbished unit goes through a multi-stage validation pipeline before it ships. We test at the electrical, thermal, and software layers to ensure the hardware meets or exceeds its original factory specifications. Test reports are issued with every unit.

每件维修或翻新单元在出厂前均需通过多阶段验证流水线。我们在电气、热学和软件层面进行测试,确保硬件达到或超过原厂规格。每台设备均附带测试报告。

Power Rail Testing
电源轨测试
Verification of all voltage rails under load: VCore, VMEM, VDD_HBM, 12V input. We measure ripple, transient response, and regulation accuracy across the full power envelope including peak compute loads.
全部电压轨负载验证:VCore、VMEM、VDD_HBM、12V 输入。测量纹波、瞬态响应和调节精度,覆盖包括峰值计算负载在内的全功率包络。
EMC Compliance Testing
EMC 合规测试
Conducted and radiated emissions pre-screening per CISPR 32 / FCC Part 15. Identifies post-repair electromagnetic interference issues before units return to production environments.
依据 CISPR 32 / FCC Part 15 进行传导和辐射发射预筛查。在设备返回生产环境前识别维修后的电磁干扰问题。
Thermal Stress Testing
热应力测试
48-hour burn-in at sustained TDP followed by thermal cycling (-10 to +85 C). Validates solder joint reliability and catches infant mortality failures before deployment.
持续 TDP 下 48 小时老化测试,随后进行 -10 至 +85 C 温度循环。验证焊点可靠性并在部署前捕获早期失效。
Firmware Qualification
固件资质认证
BIOS/BMC firmware validation, UEFI Secure Boot verification, and GPU VBIOS integrity checks. Ensures firmware revisions match the hardware revision and OEM security requirements.
BIOS/BMC 固件验证、UEFI 安全启动确认及 GPU VBIOS 完整性检查。确保固件版本与硬件版本及 OEM 安全要求匹配。
Performance Benchmarking
性能基准测试
Compute throughput (TFLOPS), HBM bandwidth, NVLink/PCIe interconnect throughput, and ECC memory error rates. Benchmark results are compared against known-good reference baselines for the specific SKU.
计算吞吐量 (TFLOPS)、HBM 带宽、NVLink/PCIe 互连吞吐量和 ECC 内存错误率。基准结果与特定 SKU 的已知良品参考基线进行对比。
Test Documentation
测试文档与认证
Every unit ships with a detailed test report: test conditions, pass/fail criteria, measured values, and technician sign-off. Reports are archived for 5 years and available for customer audit.
每台设备均附带详细测试报告:测试条件、通过/失败标准、测量值和技术员签字。报告存档 5 年,可供客户审计。
Deliverables
Full test report per unit, benchmark comparison data
Burn-in
48h sustained load + thermal cycling
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Lifecycle Management 全生命周期管理

Asset Tracking, Maintenance & Disposition

GPU hardware depreciates fast. We help data center operators maximize the usable life and residual value of every unit through structured asset management — from intake tagging to end-of-life disposition, with full chain-of-custody documentation.

GPU 硬件折旧速度快。我们通过结构化资产管理帮助数据中心运营商最大化每台设备的可用寿命和残值 — 从入库标记到报废处置,全程保管链文档化。

Asset Tracking
资产追踪
Unique serial number system with barcode and RFID tagging. Full repair history, configuration changes, and location transfers recorded against each asset ID. Integrates with customer CMDB via API.
唯一序列号系统,支持条码和 RFID 标签。每个资产 ID 下记录完整维修历史、配置变更和位置转移。可通过 API 与客户 CMDB 集成。
Preventive Maintenance
预防性维护
Scheduled inspection programs based on operating hours and environmental conditions. Thermal paste replacement, connector re-seating, firmware patching, and fan bearing inspection on recommended intervals.
基于运行时长和环境条件的定期检查计划。按推荐周期进行导热硅脂更换、连接器重新插拔、固件补丁和风扇轴承检查。
FRU Management
FRU 管理
Field Replaceable Unit inventory management: fans, heatsinks, power modules, NVLink cables, and memory DIMMs. Stocking levels determined by failure rate data and fleet size.
现场可更换单元库存管理:风扇、散热器、电源模块、NVLink 线缆和内存条。库存水平根据故障率数据和设备规模确定。
Data Sanitization
数据销毁合规
NIST SP 800-88 compliant data sanitization for decommissioned hardware. Cryptographic erase for NVMe/SSD, degaussing for HDD, and physical destruction options with certificate of destruction.
符合 NIST SP 800-88 的退役硬件数据销毁。NVMe/SSD 加密擦除、HDD 消磁,以及附带销毁证书的物理销毁选项。
Inventory Forecasting
库存优化与预测
Demand forecasting for spare parts and replacement units based on fleet age distribution, historical failure patterns, and planned capacity changes. Reduces both stockout risk and carrying cost.
基于设备年龄分布、历史故障模式和规划产能变化,对备件和替换单元进行需求预测。同时降低缺货风险和持有成本。
End-of-Life Disposition
报废处置
Responsible hardware disposition: tested-working units routed to secondary markets, non-recoverable units sent to R2/e-Stewards certified recyclers. Full audit trail for environmental compliance.
负责任的硬件处置:可用设备导入二级市场,不可恢复设备送至 R2/e-Stewards 认证回收商。全程审计轨迹确保环保合规。
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Service Lines服务线
36
Capabilities能力项
IPC
Certified Standards认证标准
30+
Countries Served服务国家
04

Supply Chain Solutions 供应链解决方案

Sourcing, Logistics & Counterfeit Prevention

Access to a global network of qualified component suppliers and logistics partners. We source genuine spare parts, manage buffer inventory, and handle cross-border shipping for GPU hardware — partnering with Tyson Supply Chain for last-mile delivery worldwide.

对接全球合格元器件供应商和物流合作伙伴网络。我们采购正品备件、管理缓冲库存、处理 GPU 硬件跨境物流 — 与 Tyson Supply Chain 合作实现全球最后一公里交付。

Global Sourcing Network
全球采购网络
Qualified supplier relationships across North America, Asia-Pacific, and Europe. Direct sourcing from authorized distributors with documented chain-of-custody for critical components.
覆盖北美、亚太和欧洲的合格供应商关系。从授权经销商直接采购关键元器件,附带文档化保管链。
Inventory & Warehousing
库存与仓储
ESD-controlled warehousing for GPU modules, FRUs, and spare PCBs. Real-time inventory visibility through our tracking system. Consignment and VMI models available for high-volume customers.
GPU 模块、FRU 和备用 PCB 的 ESD 控制仓储。通过追踪系统实时库存可见。为大批量客户提供寄售和 VMI 模式。
Just-in-Time Delivery
准时制交付
Coordinated logistics to minimize hardware downtime. Critical parts expedited within 24-48 hours. Standard shipments on 5-day lead time. Full tracking and insurance on all shipments.
协调物流以最小化硬件停机时间。关键零部件 24-48 小时加急。标准发货 5 天交期。所有发运全程追踪和保险。
Vendor Qualification
供应商资质管理
Formal vendor assessment program: quality management review, on-site audit, sample testing, and ongoing performance scorecards. New suppliers undergo a 90-day qualification period.
正式供应商评估计划:质量管理审查、现场审计、样品测试和持续绩效评分。新供应商需通过 90 天资质认定期。
Counterfeit Detection
假冒元件检测
Incoming inspection per SAE AS6171/AS6081: visual/microscopic examination, X-ray analysis, XRF material analysis, and decapsulation testing when required. Reject rates and findings reported to GIDEP.
依据 SAE AS6171/AS6081 进行来料检验:目视/显微检查、X 射线分析、XRF 材料分析,必要时进行开封测试。拒收率和发现报告至 GIDEP。
Tyson Supply Chain Partnership
Tyson Supply Chain 合作
Integrated logistics partnership for global coverage. Bonded warehousing, customs brokerage, and door-to-door delivery for GPU hardware shipments across 30+ countries.
集成物流合作实现全球覆盖。保税仓储、报关代理及 GPU 硬件发运的 30+ 国家门到门交付。
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Technical Consulting 技术咨询

Lab Design, Process Engineering & Training

We help organizations build their own GPU repair and refurbishment capabilities. From workshop layout and equipment selection to ESD programs and technician certification — our consulting engagements are scoped to deliver a turnkey operation.

我们帮助组织建立自有 GPU 维修和翻新能力。从车间布局和设备选型到 ESD 规程和技术员认证 — 我们的咨询项目以交付交钥匙运营为目标。

Workshop & Lab Setup
车间与实验室建设
Complete lab design: floor plan, HVAC specs (Class 100K cleanroom where needed), power distribution, compressed air, fume extraction, and equipment placement. Delivered as build-ready engineering drawings.
完整实验室设计:平面图、暖通规格(需要时 10 万级洁净室)、配电、压缩空气、烟雾排放和设备布局。以施工级工程图纸交付。
ESD Compliance Program
ESD 合规体系设计
ANSI/ESD S20.20 program design: EPA (ESD Protected Area) specifications, grounding verification schedules, wrist strap monitoring, ionizer placement, and packaging requirements.
ANSI/ESD S20.20 体系设计:EPA(静电防护区域)规格、接地验证时间表、腕带监测、离子风机布局和包装要求。
Manufacturing Environment
制造环境规范
Temperature, humidity, and particulate control specifications for GPU rework environments. Monitoring system design with data logging for SPC (Statistical Process Control) and audit readiness.
GPU 返工环境的温度、湿度和颗粒物控制规范。带数据记录的监控系统设计,支持 SPC(统计过程控制)和审计准备。
Process Design
维修流程设计
End-to-end repair process documentation: intake SOP, diagnostic flowcharts, rework procedures, test protocols, and shipping standards. Designed for repeatability and operator independence.
端到端维修流程文档:接收 SOP、诊断流程图、返工程序、测试协议和发运标准。设计目标为可重复性和操作员独立性。
Technician Training
技术员培训
Hands-on training programs: BGA rework technique, micro-soldering fundamentals, X-ray interpretation, thermal profiling, and diagnostic methodology. IPC certification preparation included.
实操培训课程:BGA 返工技术、微焊接基础、X 射线判读、热曲线分析和诊断方法论。包含 IPC 认证准备。
Quality Management
质量管理体系
QMS implementation aligned with ISO 9001:2015 requirements: document control, corrective action procedures, internal audit programs, and management review processes tailored to hardware repair operations.
与 ISO 9001:2015 要求对齐的 QMS 实施:文件控制、纠正措施程序、内部审计计划和针对硬件维修运营定制的管理评审流程。
Ramp-Up Program
新产品导入
Structured ramp-up programs for new hardware platforms. Rapid onboarding for new GPU architectures and server designs with defined milestones and yield targets.
面向新硬件平台的结构化导入计划。快速适配新 GPU 架构和服务器设计,明确里程碑和良率目标。
Engagement
4-12 week consulting projects
Deliverables
Engineering drawings, SOPs, training materials
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Compliance Services 合规服务

Regulatory, Environmental & Safety Compliance

Hardware repair and refurbishment operations must navigate a complex regulatory landscape. We manage restricted substance compliance, product safety documentation, and environmental specifications so your hardware meets all applicable standards before re-entering the supply chain.

硬件维修和翻新运营需要应对复杂的法规环境。我们管理限制物质合规、产品安全文档和环境规范,确保硬件在重新进入供应链前满足所有适用标准。

RoHS / REACH Compliance
RoHS / REACH 合规
Restricted substance management for lead, cadmium, mercury, hex-chrome, PBBs, PBDEs, and REACH SVHC candidate list substances. XRF screening of replacement components. Compliance declarations prepared per customer format.
铅、镉、汞、六价铬、PBBs、PBDEs 和 REACH SVHC 候选清单物质的限制物质管理。替换元器件 XRF 筛查。按客户格式准备合规声明。
Chemical Management
化学品管理
SDS (Safety Data Sheet) documentation for all chemicals used in repair: flux, solder paste, cleaning agents, conformal coatings. Chemical inventory tracking with proper storage segregation and disposal procedures.
维修中使用的所有化学品 SDS(安全数据表)文档:助焊剂、锡膏、清洁剂、三防漆。化学品库存追踪,含正确的分类储存和处置程序。
Product Safety Certification
产品安全认证
Support for UL, CSA, CE, and CCC safety certification maintenance after repair. Documentation that repair activities do not void original product safety certifications. Test evidence packages for NRTL audits.
维修后 UL、CSA、CE 和 CCC 安全认证维护支持。维修活动不使原产品安全认证失效的文档证明。NRTL 审计测试证据包。
Environmental Auditing
环境审计
Environmental compliance specifications for repair facilities: waste stream management, air quality monitoring, water discharge permits, and hazardous materials handling. Audit preparation and remediation support.
维修设施环境合规规范:废弃物流管理、空气质量监测、排水许可和危险材料处理。审计准备和整改支持。
Audit Readiness
审计就绪
Audit-ready operations with full documentation trail. Open-book transparency for enterprise and institutional clients, with 30-day notice audit access and complete traceability records.
审计就绪的运营体系,完整文档链。面向企业和机构客户的全透明管理,30 天通知审计访问权及完整可追溯记录。
Export Control Compliance
出口管制合规
ECCN classification for GPU hardware subject to EAR (Export Administration Regulations). Denied party screening, license determination, and record-keeping for controlled technology transfers.
受 EAR(出口管理条例)管辖的 GPU 硬件 ECCN 分类。被拒绝方筛查、许可判定和受控技术转让记录保存。
Industry Standards
行业标准合规
Conformance to IPC-A-610 (acceptability of electronic assemblies), IPC-7711/7721 (rework/repair), JEDEC moisture sensitivity handling, and J-STD-001 (soldered electrical connections). Gap analysis and compliance roadmaps.
符合 IPC-A-610(电子组件验收)、IPC-7711/7721(返工/维修)、JEDEC 湿敏处理和 J-STD-001(焊接电气连接)标准。差距分析和合规路线图。
RoHS REACH IPC-A-610 IPC-7711/7721 J-STD-001 JEDEC ISO 9001 EAR UL / CSA / CE
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Get Started 开始合作

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准备好了吗?

Tell us about your hardware, fleet size, and timeline. We respond within one business day.

告诉我们您的硬件类型、设备规模和时间安排。我们将在一个工作日内回复。

info@tensorrevive.com